Our home-made SWIR microscope uses short-wave infrared light to image semiconductor materials and structures that are opaque at visible wavelengths. Its high-resolution, high-contrast imaging capability supports semiconductor metrology applications such as wafer inspection, bonding-interface evaluation, and defect characterization, particularly the non-destructive detection of internal cracks, voids, delamination, contamination, and other subsurface defects without sectioning or damaging the device.

The high power (200 mW) DFB laser at 1550 nm is an ideal light source for silicon wafer metrology as it works in the transparency window of silicon. This laser has a bandwidth of 50 kHz, corresponding to a spectrum linewidth of 0.0004 pm and a coherence length of 1.9 km. The excellent monochromatic property allows us to observe strong interference in metrology applications.

The 1550 nm f-theta telecentric lens provides a nearly linear relationship between scan angle and image position while maintaining the beam approximately normal to the sample across the field of view. These characteristics enable uniform spot size, reduced geometric distortion, and consistent measurement sensitivity during large-area scanning, making the lens well suited for high-precision semiconductor metrology applications such as wafer inspection, subsurface defect detection, critical-dimension measurement, and spatially resolved thermal mapping.

The Dual Axis Galvanometer Optical Scanner allows fast scan speeds without producing excessive heat. The position sensor provides up to ten times the signal-to-noise ratio of conventional galvanometers, ensuring high quality motion. This scanner is ideal for use in fast wafer scan for metrology due to its fast response and accurate mirror control.

The CamIR 1550nm NIR Camera is specifically engineered for imaging in the SWIR region, aligning with the optical transparency window of silicon. It enables non-destructive optical access beneath the wafer surface. The camera is particularly well-suited for semiconductor wafer inspection, where it can reveal subsurface features such as microcracks, voids, inclusions, and buried defects that are otherwise hidden.

The Plan APO NIR LCD Infinity-Corrected Objective from Mitutoyo is specifically optimized for high-performance imaging in the short-wave infrared (SWIR) spectral range. Designed with NIR coatings and apochromatic correction, this objective delivers excellent transmission, minimal chromatic aberration, and high contrast at wavelengths around 1550 nm, making it highly suitable for silicon-based applications. This objective is particularly well-suited for wafer inspection, enabling clear visualization of subsurface structures and internal defects, making it an ideal choice for precision semiconductor metrology and research applications.

The Optical Power and Energy Meter Console is a versatile measurement platform designed for precise optical power characterization across a broad spectral range, including the SWIR region. When paired with compatible SWIR-sensitive sensors, it enables accurate monitoring of optical signals around 1550 nm, within the transparency window of silicon. This capability makes it particularly suitable for wafer inspection systems, where reliable measurement of transmitted or scattered light is critical for detecting subsurface defects and characterizing material properties.

The Denton Thermal Evaporator is a high-vacuum thin-film deposition system used for the controlled deposition of metals and other materials onto a wide range of substrates. It operates by resistively heating source materials in evaporation boats or crucibles, producing a vapor that condenses uniformly on the substrate surface. The system provides precise control over deposition rate and film thickness, enabling high-quality coatings for microelectronics, optics, and sensor fabrication. Owing to its reliability, material versatility, and compatibility with lift-off processes, the Denton Thermal Evaporator is widely employed in research laboratories and microfabrication facilities.

The e-beam evaporator is a high-vacuum thin-film deposition system that uses a focused electron beam to heat and evaporate source materials with very high melting temperatures. The electron beam precisely melts the target material in a crucible, generating a vapor that deposits uniformly onto the substrate with excellent thickness and rate control. This technique enables the deposition of high-purity, dense metal and dielectric films commonly used in microelectronics, optics, MEMS, and nanofabrication. Due to its ability to deposit refractory materials, low contamination, and superior film quality, e-beam evaporation is widely adopted in both research and advanced manufacturing environments.

The Xactix XeF₂ Silicon Etcher is a precision dry etching system designed for highly selective, isotropic etching of silicon using XeF₂. Operating at room temperature and low pressure, it enables damage-free removal of silicon without the need for plasma, making it ideal for delicate micro- and nanofabrication processes. The system offers excellent selectivity to common materials such as photoresist, silicon dioxide, silicon nitride, and metals, allowing precise release of MEMS structures, undercutting, and sacrificial layer removal. With its simple operation, high repeatability, and minimal surface contamination, the Xactix XeF₂ Si Etcher is widely used in MEMS fabrication, microelectronics, and research laboratories.

The Plasma-Therm Reactive Ion Etcher (RIE) is a plasma-based microfabrication system used for anisotropic dry etching of semiconductor and thin-film materials. It operates by generating a low-pressure plasma in which reactive ions chemically and physically interact with the sample surface to achieve controlled, directional etching. The system enables precise pattern transfer with high etch selectivity and uniformity for materials such as silicon, oxides, nitrides, and polymers. Plasma-Therm RIE tools are widely used in MEMS fabrication, semiconductor processing, and advanced materials research.

The sputter coater is a vacuum-based deposition system used to apply thin conductive coatings, typically metals such as gold or platinum, onto samples for electron microscopy and other surface analyses. It operates by bombarding a target material with energetic ions, causing atoms to be ejected and deposited uniformly onto the sample surface. This coating improves surface conductivity, reduces charging effects, and enhances imaging quality in SEM and other electron-based techniques. Sputter coaters are widely used in materials science, biology, and nanotechnology for sample preparation and surface modification.

The Hitachi Scanning Electron Microscope (SEM) is an advanced imaging and analysis instrument used to examine surface morphology and microstructural features with high spatial resolution. It operates by scanning a focused electron beam over the sample surface and detecting emitted signals such as secondary and backscattered electrons to generate detailed images. Hitachi SEM systems enable high-magnification observation, elemental analysis when integrated with EDS, and precise characterization of materials, devices, and biological samples. Owing to their stability, image quality, and user-friendly operation, Hitachi SEMs are widely used in materials science, semiconductor research, nanotechnology, and failure analysis.

The Keyence Laser Confocal Microscope is a high-resolution optical characterization system designed for non-contact, three-dimensional surface and structural analysis. It operates on the principle of laser confocal scanning, which eliminates out-of-focus light to produce sharp images with high depth resolution and accurate height measurements. The system enables rapid 3D profiling, surface roughness analysis, and thickness measurement of transparent and opaque materials. With its ease of use, fast data acquisition, and high measurement accuracy, the Keyence Laser Confocal Microscope is widely used in materials research, microfabrication, semiconductor inspection, and quality control.

X-ray diffraction (XRD) is a non-destructive characterization technique based on the diffraction of X-rays by the periodic atomic planes of a crystalline material, where constructive interference occurs when Bragg’s law is satisfied. XRD is widely used to identify crystalline phases and determine crystal structures in metals, ceramics, semiconductors, and thin films. It is also applied to evaluate crystallite size, lattice strain, texture, and phase purity for materials development, process optimization, and quality control in both research and industrial settings.

The Kratos X-ray Photoelectron Spectroscopy (XPS) system is a powerful surface analysis instrument used to determine the elemental composition and chemical states of materials. It operates by irradiating a sample with monochromatic X-rays and measuring the kinetic energy of emitted photoelectrons, providing quantitative information from the top few nanometers of the surface. Kratos XPS systems enable detailed analysis of surface chemistry, oxidation states, and thin-film composition. Due to their high sensitivity, excellent energy resolution, and reliability, they are widely used in materials science, semiconductor research, catalysis, and surface engineering.

The Nova BET Analyzer is a gas adsorption characterization instrument used to measure the specific surface area, pore size distribution, and total pore volume of solid materials. It operates based on Brunauer–Emmett–Teller (BET) theory by analyzing the adsorption and desorption behavior of gases, typically nitrogen, on the material surface under controlled conditions. The system provides accurate and reproducible evaluation of porous and high-surface-area materials. As a result, the Nova BET Analyzer is widely applied in catalysis, energy storage, nanomaterials, pharmaceuticals, and materials research.