SEMICONDUCTOR METROLOGY AND QUALITY CONTROL

The purpose of this project is to develop optical platforms for in-line and real-time semiconductor metrology and validation. The advanced packaging technology opens a new era of semiconductor integration but also brings challenges: thermal accumulation, thermal and assembly stress, and alignment error, etc. These can reduce the device performance or even cause severe damages. As semiconductor chips move to 3-dimensional, monitoring and validation of semiconductor status and health becomes critical. With our rich experience on optical metrology technology, we will develop optical systems that monitors the 3D temperature and stress distribution, TSV/TGV alignment error, and chip deformation in real-time. With these information, it helps the engineers to optimize chip design and realize a dynamic power control to optimize the chip performance.

Laser Ablation of “PURDUE” Pattern on Silicon Wafer